منابع مشابه
A Model of Void Formation
We introduce a simple model for the formation of voids. In this model the underdensity of galaxies in voids is the product of two factors. The first arises from a gravitational expansion of the negative density perturbation. The second is due to biasing: galaxies are less likely to form in an underdense region. One feature of the model is an upper cutoff in void sizes. We calculate the volume f...
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A review of the study of superclusters based on the 2dFGRS and SDSS is given. Real superclusters are compared with models using simulated galaxies of the Millennium Run. We show that the fraction of very luminous superclusters in real samples is about five times greater than in simulated samples. Superclusters are generated by large-scale density perturbations which evolve very slowly. The abse...
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In recent times, there has been a growing interest in the machining of amorphous metallic alloys, which are also called bulk metallic glasses (BMGs). These materials differ from common polycrystalline metallic alloys, because their atoms do not assemble on a crystalline lattice, and as a result, they have unique physical, mechanical, and chemical properties. A number of BMGs have been found to ...
متن کاملVoid formation induced electrical switching in phase-change nanowires.
Solid-state structural transformation coupled with an electronic property change is an important mechanism for nonvolatile information storage technologies, such as phase-change memories. Here we exploit phase-change GeTe single-nanowire devices combined with ex situ and in situ transmission electron microscopy to correlate directly nanoscale structural transformations with electrical switching...
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The effect of electroplated Cu (EPC), electroplated Sn (EPS) and Cu addition (0.7 wt.%) on the void formation at the reaction interfacewas investigated through the reaction of solderswithCu substrates. The voidswere observed at the Cu3Sn/EPC interface in the Sn/EPC joints after aging at 150 C, while not at the Cu3Sn/high purity Cu (HPC) interface in the Sn/HPC joints even after aging at 180 C f...
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ژورنال
عنوان ژورنال: New Journal of Physics
سال: 2007
ISSN: 1367-2630
DOI: 10.1088/1367-2630/9/8/253